Warping - Print-Stress

print stress warping parts bowing during thermal curing print stress warping how to identify large xy cross sections bow away bow away from their platform facing surface cause orientation solution print preparation or part design troubleshooting print preparation or part design adjustments the following solutions will address print or part related causes of the defects choose among the suggested actions below and select the best approach for your application usually only one type of adjustment is needed orientation reorient parts to minimize xy cross section, especially on the platform orientation if problems persist, please reach out to carbon support explanation & causes explanation internal stresses are created in large xy cross sections during printing that are released during curing most prominent with large, thin cross sections on the platform the platform itself further constrains the part, amplifying the print stress more common with rigid two part resins print stress warping occurs in large xy cross sections with resins that have a high cross link density in their green state commonly seen with rigid two part resins as the material builds its end state polymer network in the thermal curing process, the uv network built in the green state breaks down and those stresses are released causes print preparation or part design how the part is oriented , supported , or designed is causing the defect print preparation or part design cause root issue problem why defect presents orientation large, thin cross section on the platform the platform constrains the part with resins that have a high cross linked density in their green state (ie during printing), that constraint builds high stress that is released during thermal curing